Journal Title
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Publisher
Springer, Boston, MA
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Authors: Yi Li Daniel Lu C P Wong
Publish Date: 2010
Volume: , Issue: , Pages: 303-360
Abstract
Patterning of electronics to obtain specific designs is conventionally carried out on wafer or substrates by photolithography This is a process to transfer images and patterns from a mask to the surface of a wafer or substrate The steps typically involved in the photolithographic process are wafer or substrate cleaning barrier layer formation photoresist application soft baking mask alignment exposure and development and hardbaking
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