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Authors: Nancy E Iwamoto
Publish Date: 2015
Volume: , Issue: , Pages: 81-132
Abstract
In order to scale mechanical properties from molecular structures using coarsegrained methods strategies must be developed to help the investigator that allows prediction not only of the initial modulus operating in the pure elastic region of response but also of the entire mechanical response ie prediction in how the material fails with composition The current chapter investigates methods to obtain the full stress–strain curve to failure for a copper oxideepoxy interface which includes both smooth and rough interfaces moisture and the effect of filler using coarsegrained methods Of interest is the ability to use coarsegraining to jump length scales by using bead units larger than functional groups the ability of these models to discern changes in composition such as crosslink density moisture and filler and the interesting trend of adhesion with interfacial roughness which has been likened to a Hall–Petch effect The use of coarsegrained models will be very useful to bridge scales but will depend upon the ability to derive and apply the correct parameterization of the beadsThis paper is based upon “Developing the mesoscale stress–strain curve to failure” Proceeding of Eurosime 2011 April 18–20 Linz Austria “Molecularly Derived Mesoscale Modeling of an Epoxy/Cu Interface Part III Interface Roughness” Eurosime Lisbon Portugal April 16–18 2012“Molecularly derived mesoscale modeling of an epoxy/Cu interface Interface roughness” Nancy Iwamoto Microelectronics Reliability Volume 58 Issue 8 Pages 1101–1110 and “Molecularly Derived Mesoscale Modeling of an Epoxy/Cu Interface Part IV The effect of Filler” Nancy Iwamoto Proceeding of Eurosime 2013 April 15–17 Wroclaw Poland
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