Authors: Šimeková Beáta Hodúlová Erika Kovaříková Ingrid
Publish Date: 2017/03/14
Volume: 61, Issue: 3, Pages: 613-621
Abstract
Properties of leadfree solder alloys and microstructural characterization of solder joints made from Sn10Ag05Cu10Bi and Sn09Ag05Cu09Bi10In composition given in weight with Cu plate were widely studied in this work The influence of Bi and In additions in these solder alloys was studied as well The melting temperatures diffluence and wetting properties microstructures and costs were observed and evaluated ThermoCalc software was used for phase composition prediction Altogether 1500 cycles were carried out for the thermal cycling test in the range from +150 to −40 °C where the solder joints’ reliability was assessed due to practice requirement Optical microscopy scanning electron microscopy EDX microanalysis and shear strength test were used for the evolution of microstructure structural integrity and mechanical strength of thermalcycled solder joints The reliability test results after temperature cycling indicate two leadfree solder alloys as the most convenient for soldering in the microelectronics industryThis research is supported by VEGA Grant No 1/0455/14 Grant No APVV0023/12 and OP for project Centre of Excellence of Fiveaxis Machining Experimental Base for High Tech Research ITMS 26220120045 and cofinanced the by European Funds for Regional Development
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