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Title of Journal: Int J Miner Metall Mater

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Abbravation: International Journal of Minerals, Metallurgy, and Materials

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University of Science and Technology Beijing

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DOI

10.1016/0161-7346(89)90018-7

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ISSN

1869-103X

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Microstructural characterization of Cu/Al composit

Authors: Yanqiu Han Lihua Ben Jinjin Yao Chunjing Wu
Publish Date: 2015/01/10
Volume: 22, Issue: 1, Pages: 94-101
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Abstract

Cu/Al composites are of vital importance in industrial applications because of their numerous advantages The influence of bonding temperature and cooling rate on the microstructure and morphology of Cu/Al composites was investigated in this paper The interfacial morphology and constituent phases at the Cu/Al interface were analyzed by optical microscopy and fieldemission scanning electron microscopy equipped with energydispersive Xray spectroscopy The results indicate that effective CuAl bonding requires a higher bonding temperature to facilitate interdiffusion between the two metals The microstructural characteristics are associated with various bonding temperatures which impact the driving force of interdiffusion It is observed that cooling rate exerts a significant influence on the morphology and amount of the intermetallic compounds at the interfacial region Meanwhile microhardness measurements show that hardness varies with the bonding temperature and rate of cooling

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