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Title of Journal: Int J Precis Eng Manuf

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Abbravation: International Journal of Precision Engineering and Manufacturing

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Korean Society for Precision Engineering

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DOI

10.1016/0009-2614(73)85228-5

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ISSN

2005-4602

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Chemical mechanical planarization of copper bumps

Authors: MoonKi Jeong SeungJae Jo HyunSeop Lee AhReum Lee ChungYun Kang JinWon Choi JinHo Kim HaeDo Jeong
Publish Date: 2011/02/04
Volume: 12, Issue: 1, Pages: 149-152
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Abstract

This paper deals with the planarization of copper bumps to improve the bonding performance and reliability of printed circuit board PCB manufacturing to improve by using flip chip during the fabrication process of the PCB Authors tried to develop a novel planarization process using polishing techniques before the continuous process at the PCB fabrication An experiment was implemented by mechanical polishing MP using alumina abrasives mixed with deionizer water DIW and by chemical mechanical polishing CMP added with oxidizer of HF CMP showed superior results to MP with mirror surface less than Ra 3nm and minimum step height deviation of 1um resulting in high bonding performance and reliability Therefore CMP is a strong tool for reserving a sufficient margin in the PCB manufacture process

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Other Papers In This Journal:
  1. Valveless piezoelectric micropump of parallel double chambers
  2. Performance of honed surface profiles to artificial hip joints: An experimental investigation
  3. Direct fabrication of nano-wrinkled 3D microstructures using fitfully accumulated two-photon polymerization
  4. Machining model of position-attitude in Magnetorheological Finishing (MRF) of high-precision off-axis aspheric optical elements
  5. Direct visual servoing framework based on optimal control for redundant joint structures
  6. Development of warm forming parts for automotive body dash panel using AZ31B magnesium alloy sheets
  7. Design optimization method for 7 DOF robot manipulator using performance indices
  8. Beam vibration control using cellulose-based Electro-Active Paper sensor
  9. Dry rotary swaging–approaches for lubricant free process design
  10. Preparation of micro-channel catalytic reactor coated with macro-porous Al 2 O 3 for fuel reformer
  11. Development of a surface-based virtual dental sculpting simulator with multimodal feedback
  12. Kinetic role of the metatarsophalangeal joint in normal walking: Joint moment and power
  13. Development of acoustic emission signal parameter and its application for strength estimation of friction welded joints
  14. Optimal product design for life cycle assessment (LCA) with the case study of universal motors
  15. From design for manufacturing (DFM) to manufacturing for design (MFD) via hybrid manufacturing and smart factory: A review and perspective of paradigm shift
  16. Molecular dynamics simulations of plastic material deformation in machining with a round cutting edge
  17. Physical simulation of small melter for LTCC (low temperature co-fired ceramic) frit
  18. NDE of low-velocity impact damages in composite laminates using ESPI, digital shearography and ultrasound C-scan techniques
  19. Development of post processor for five-axis machine of non-orthogonal head tilting type
  20. Influence of current collector and cathode area discrepancy on performance evaluation of solid oxide fuel cell with thin-film-processed cathode
  21. Research advancement of green technologies
  22. Texture evolution in low-C flat rolled steels on the physical properties
  23. Generation of velocity profiles with speed limit of each axis for high-speed machining using look-ahead buffer
  24. Comparative studies of parameters calibration for focused ion beam deposition
  25. Development of a new head/brain model for the prediction of subdural hemorrhage
  26. Prediction of heating-line paths in induction heating process using the artificial neural network
  27. Multi objective optimization of friction stir welding parameters using FEM and neural network
  28. Service reliability improvement in manufacturing and operating systems
  29. A study on the characteristics of a wafer-polishing process according to machining conditions
  30. FlipBot: A new field robotic platform for fast stair climbing
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