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Title of Journal: Continuum Mech Thermodyn

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Abbravation: Continuum Mechanics and Thermodynamics

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Springer-Verlag

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DOI

10.1002/hep.1840120511

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1432-0959

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Fracture and debonding of a thin film on a stiff s

Authors: Andrés Alessandro León Baldelli Blaise Bourdin JeanJacques Marigo Corrado Maurini
Publish Date: 2012/05/12
Volume: 25, Issue: 2-4, Pages: 243-268
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Abstract

We study multifissuration and debonding phenomena of a thin film bonded to a stiff substrate using the variational approach to fracture mechanics We consider a reduced onedimensional membrane model where the loading is introduced through uniform inelastic eg thermal strains in the film or imposed displacements of the substrate Fracture phenomena are accounted for by adopting a Griffith model for debonding and transverse fracture On the basis of energy minimization arguments we recover the key qualitative properties of the experimental evidences like the periodicity of transverse cracks and the peripheral debonding of each regular segment Phase diagrams relate the maximum number of transverse cracks that may be created before debonding takes place as a function of the material properties and the sample’s geometry The theoretical results are illustrated with numerical simulations obtained through a finite element discretization and a regularized variational formulation of the Ambrosio–Tortorelli type which is suited to further extensions in twodimensional settings

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