Authors: Ashutosh Sharma HeungRak Sohn Jae Pil Jung
Publish Date: 2015/10/28
Volume: 47, Issue: 1, Pages: 494-503
Abstract
The effect of graphene nanoplatelets GNPs on the wettability microstructure and tensile properties of Sn30Ag05Cu SAC 305 was studied using melting and casting route The microstructure of the bulk solder is observed with a scanning electron microscope and transmission electron microscope and the intermetallic compound IMC phases are identified by electron probe microanalyzer The solderability of the samples is assessed by spreading and wetting tests on a Cu substrate The experimental results indicate that an addition of 005 wt pct GNPs in Sn3Ag05Cu solder improves the spreading and wettability significantly compared to monolithic SAC It is also revealed that the thickness of the Ag3Sn IMCs is reduced as compared to the monolithic SAC alloy Tensile results show that the composite solder exhibits the 139 pct elongation and 17 pct increase in the ultimate tensile strength when 005 wt pct GNPs in Sn3Ag05Cu alloy are added This may be due to the refinement of the IMCs in composite solders compared to the same in Sn3Ag05Cu alloy brought about by the uniform dispersion of graphene nanoplatelets It is suggested in this study that the amount of GNPs in Sn3Ag05Cu alloy should not exceed 005 wt pct as it may degrade the desired properties due to the agglomeration of GNPsThis work was supported by the Technology Innovation Program or Industrial Strategic technology development program 10051436 Development and mass production of 25 pct reduced prices nanomicro compound Pbfree solder paste for automotive devices to respond to ELV Directive funded By the Ministry of Trade Industry Energy MI Korea
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