Authors: William Hand George Cheng Brian Via Sujit Banerjee
Publish Date: 2016/10/27
Volume: 75, Issue: 1, Pages: 135-138
Abstract
The degree to which liquid phenol formaldehyde resin for flakeboard applications can be replaced by soy flour was studied through a design of experiment approach Up to ten percent substitution could be achieved while substantially maintaining board properties Higher levels of substitution increased the viscosity of the resin droplet which reduced resin spread and various strength properties The loss of strength was most apparent for dense boards where the spreading limitation reduced the relative bonded area
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