Authors: Yu Plevachuk V Sklyarchuk A Yakymovych P Svec D Janickovic E Illekova
Publish Date: 2012/02/24
Volume: 21, Issue: 5, Pages: 585-589
Abstract
Tinbismuthsilver alloys are under intense consideration as favorable leadfree solders for consumer electronics and telecommunications The investigated samples of AgBi10Sn with Ag content from 333 to 10 at were prepared both in the traditional bulk form and in the ribbon form by the rapid solidification technique The electrical conductivity and thermal conductivity thermoelectric power and viscosity studies were carried out in a wide temperature range above the liquidus Corresponding fit relations have been derivedThis article is an invited submission to JMEP selected from presentations at the Symposia “Wetting soldering and brazing” and “Diffusion bonding and characterization” belonging to the Topic “Joining” at the European Congress and Exhibition on Advanced Materials and Processes EUROMAT 2011 held September 1215 2011 in Montpellier France and has been expanded from the original presentationThis work was carried out within the framework of the COST Action MP0602 joint SlovakUkrainian project APVVSKUA004309 projects APVV010207 and VEGA 2/0111/11 and supported by the National Scholarship Programme of the Slovak Republic Minerva and the Fundamental Researches State Fund of Ukraine projects F28255 F28329
Keywords: