Authors: Weihong Wu Jingjing Leng Zheng Wang Hongqiang Qu Jungang Gao
Publish Date: 2016/03/22
Volume: 24, Issue: 3, Pages: 209-217
Abstract
Boroncontaining bisphenolS formaldehyde resin BBPSFR with different amounts of nanoSiO2 by in situ formation was used to cure ocresol formaldehyde epoxy resin oCFER The curing kinetics dynamic mechanical properties and thermal stability of BBPSFR/oCFER/nanoSiO2 composites BCS were investigated by differential scanning calorimetry DSC dynamic mechanical analysis DMA thermogravimetry TG and thermogravimetrymass spectrometry TGMS Morphology of nanoSiO2containing BBPSFR and glass fiber laminates of the BCS were characterized by transmission electron microscopy TEM and scanning electron microscopy SEM The mechanical properties and electrical properties were also determined The results showed that nanoSiO2 accelerated the curing process and decreased the curing temperature the nonisothermal curing kinetics of the BCS can be described by the twoparameter m n ŠestákBerggren kinetic model and the average value of m was 032 and n was 100 The thermal stability was enhanced by the addition of nanoSiO2 especially at higher temperatures and the residual weight increased with increasing nanoSiO2 content Incorporation of 6 wt of nanoSiO2 increased the impact strength from 105 to 149 kJ/m2 and storage modulus at ambient from 685 to 127 GPa and the TEM photograph of which showed that nanoSiO2 particles about 50 nm were dispersed in the matrix more uniformly The volume resistance R v and dielectric constant ε slightly increased when the nanoSiO2 content was 3 wt
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