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Title of Journal: Sci China Technol Sci

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Abbravation: Science China Technological Sciences

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Springer Berlin Heidelberg

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DOI

10.1016/0038-1098(85)90556-3

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1869-1900

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Contact stress nonuniformity of wafer surface for

Authors: TongQing Wang XinChun Lu DeWen Zhao YongYong He
Publish Date: 2013/05/18
Volume: 56, Issue: 8, Pages: 1974-1979
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Abstract

A finite element analysis FEA model is developed for the chemicalmechanical polishing CMP process on the basis of a 12in fivezone polishing head The proposed FEA model shows that the contact stress nonuniformity is less dependent on the material property of the membrane and the geometry of the retaining ring The larger the elastic modulus of the pad the larger contact stress nonuniformity of the wafer The applied loads on retaining ring and zone of the polishing head significantly affect the contact stress distribution The stress adjustment ability of a zone depends on its position In particular the innerside zone has a high stress adjustment ability whereas the outerside zone has a low stress adjustment ability The predicted results by the model are shown to be consistent with the experimental data Analysis results have revealed some insights regarding the performance of the multizone CMP

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