Authors: Qitong Wang Wenlong Jiang Shaowei Guan Yunhe Zhang
Publish Date: 2013/02/20
Volume: 23, Issue: 3, Pages: 743-750
Abstract
GNS/PVDF AGS/PVDF and AGSCuPc/PVDF composites were prepared using hot press molding technique The micromorphologies showed that the dispersion degree of the GNS in the matrix decreases in the following order AGSCuPc/PVDF AGS/PVDF GNS/PVDF It could be attributed to AGS treated with copper phthalocyanine CuPc exhibit strongest interface bonding with PVDF and acidification GNS AGS have stronger interface bonding with PVDF than GNS GNS/PVDF composites showed a slight increase in dielectric constant and dielectric loss with the growing content of fillers AGS/PVDF composites presented a better performance in dielectric constant than that of GNS/PVDF but with a much higher dielectric loss Especially AGSCuPc/PVDF threephase composite displayed better dielectric properties than GNS/PVDF and AGS/PVDF composites with a dielectric constant 327 and a dielectric loss 063 at 10 kHz It could be attributed to the cooperation of well dispersion of conductive fillers and the electric barrier effects of CuPc
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