Authors: Dijana Šimkūnaitė Emilija Ivaškevič Aleksandras Kaliničenko Antanas Steponavičius
Publish Date: 2005/07/26
Volume: 10, Issue: 7, Pages: 447-457
Abstract
The early stages of Cu electrodeposition onto Ptpoly have been investigated in 05 M H2SO4 + 001 M CuSO4 solution without or with H2SeO3 when a molar concentration ratio CuII/SeIV ≥ 2×102 using electrochemical and ex situ AFM techniques The overpotential deposition of Cu has been performed onto a Pt surface precovered independently with Cu in amount close to an equivalent monolayer Chronoamperometric results have been shown to follow an instantaneous 3D nucleation and diffusioncontrolled growth model The values of diffusion coefficient D for Cu2+ number of nuclei N and average nuclei radius r av have been calculated In the local regions of the surface the separate large agglomerates composed of the different diameter clusters have been revealed in both cases but in the presence of the H2SeO3 they attained a distinct chainlike configuration Some morphological characteristics have been reported
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