Authors: YongSeok Kim SoonYong Yang
Publish Date: 2010/01/20
Volume: 23, Issue: 12, Pages: 3366-3373
Abstract
An automatic vegetable bundling mechanism that uses thermal bonding is proposed The proposed mechanism consists of three modules for reasonable manufacturing The design specifications were determined by a bundling mechanism that was mechanically optimized and a prototype of the automatic bundling machine was manufactured A field test was carried out to verify the performance of the prototype on a vegetable farm The machine showed an efficiency of about 36 times that by manual work This automatic vegetable bundling machine has already been approved as an agricultural machine and will be commercialized soonYongSeok Kim received his BS in Mechanical Engineering from Ulsan University Korea in 2003 He then received his MS and PhD degrees in Mechanical and Automotive Engineering from Ulsan University Korea in 2005 and 2009 respectively Dr Kim is currently a post doctor at the School of Mechanical and Automotive Engineering at Ulsan University in Ulsan Korea His research interests include concurrent engineering mechanism design rapid prototyping and CADSoonYong Yang received his BS and MS degrees in Mechanical Engineering from Busan University Korea in 1979 and 1981 respectively Also he then received his MS and PhD degrees in Precision Engineering from Tokyo University Japan in 1987 and 1997 respectively Dr Yang is a professor in the school of Mechanical and Automotive Engineering at Ulsan University in Ulsan Korea His research interests include vehicles mechatronics field robot and hydraulic engineering
Keywords: