Authors: XueRu Guo WenBin Young
Publish Date: 2015/07/11
Volume: 29, Issue: 7, Pages: 2967-2974
Abstract
The flip chip process involves the deposition of solder bumps on the chip surface and their subsequent direct attachment and connection to a substrate Underfilling traditional flip chip packaging is typically performed following a twostep approach The first step uses capillary force to fill the gap between the chip and the substrate and the second step uses epoxy molding compound EMC to overmold the package Unlike traditional flip chip packaging the molded underfill MUF concept uses a singlestep approach to simultaneously achieve both underfill and overmold MUF is a simpler and faster process In this study a 2D numerical model is developed to simulate the front movement of EMC flow and the void formation for different geometric parameters The 2D model simplifies the procedures of geometric modeling and reduces the modeling time for the MUF simulation Experiments are conducted to verify the prediction results of the model The effect on void formation for different geometric parameters is investigated using a 2D modelWenBin Young received the MS and PhD degrees in Mechanical Engineering from The Ohio State University Columbus Ohio in 1988 and 1991 respectively He is a professor in the department of Aeronautics and Astronautics at the National Chung Kung University Taiwan His research interests are in the areas of composite manufacturing plastic processing injection molding and packaging
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