Authors: ZengWei Zhu Di Zhu NingSong Qu Kun Wang JianMing Yang
Publish Date: 2007/12/01
Volume: 39, Issue: 11-12, Pages: 1164-1170
Abstract
In the electroforming process for a complexshaped part it is extremely important to improve the surface smoothness and the thickness uniformity of deposits We propose a new electroforming technology in which dynamical hard particles fill the space between electrodes and are driven to move in a compound manner The profile of the anode used in the proposed technology has been optimized by the finite element method FEM The analyses and experimental results show that the particles can polish the cathode surface continuously to remove hydrogen bubbles and nodules and level the microprofiles of the deposits The optimized anode leads to nearly identical cathodic uniformity of the current density By using the abovementioned technology a nickel thinwalled revolving part with a smooth mirrorlike outer surface and excellent thickness uniformity was successfully electroformed in the bath without any organic additives Compared to traditional technology the proposed technology obtained part surface roughness that was nearly one order of magnitude lower and thickness uniformity that was about 60 greater
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