Authors: Hao Cheng Wei Yang Hong Liu HongLian Li LingJiang Wang
Publish Date: 2012/08/29
Volume: 58, Issue: 6, Pages: 598-602
Abstract
A “T” shaped microgap was fabricated by mechanical polishing between two Cu film electrodes on the surface of singlesided bonded copper A nanogap was then fabricated in the prepared microgap by resistance feedback controlled electroplating Finally Ni80Fe20 ferromagnetic nanocontacts of several sizes were fabricated in the prepared nanogap by resistance feedback controlled electroplating The magnetoresistance of each Ni80Fe20 ferromagnetic nanocontact was not related to its size Fabrication of the Ni80Fe20 ferromagnetic nanocontacts in the nanogap can reduce the contribution of magnetostriction to the magnetoresistance The magnetoresistance values of the Ni80Fe20 ferromagnetic nanocontacts were as high as those of the Ni ferromagnetic nanocontacts This implies that the contribution of magnetostriction to the ballistic magnetoresistance of the ferromagnetic nanocontacts can be neglected The ferromagnetic nanocontacts fabricated in this study and in other cases have two anisotropic interfaces on the sides of the nanocontacts However the magnetic field can alter the contribution of the interaction between the two anisotropic interfaces to the ballistic magnetoresistance of the ferromagnetic nanocontacts and this effect can not be ruled out yetThis article is published under an open access license Please check the Copyright Information section for details of this license and what reuse is permitted If your intended use exceeds what is permitted by the license or if you are unable to locate the licence and reuse information please contact the Rights and Permissions team
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