Authors: Noel M Elman Slava Krylov Marek Sternheim Yosi ShachamDiamand
Publish Date: 2007/07/28
Volume: 14, Issue: 2, Pages: 287-293
Abstract
A novel fabrication process named MASIS multiple aspect ratio structural integration in singlecrystalsilicon is introduced for the implementation of singlecrystalsilicon microstructures characterized by distinct aspect ratios to be fabricated in the same device layer The MASIS process was especially designed for fabrication of transmissive MOEMS MicroOptoElectroMechanicalSystems modulators incorporating large field areas and driven by longstroke combdrive actuators combined with folded suspensions The combdrive actuators were designed to achieve large amplitude of vibration and high natural frequencies which allow large aperture areas at high operational frequency The MASIS process consists of selective thinning of the device thickness in the shutter area reducing payload mass while preserving higher thickness of the suspension springs and combdrive transducer fingers thereby increasing the natural frequency of the device and reducing actuation voltages A modulator was successfully fabricated demonstrating maximum displacement of 50 μm at 1 kHz in resonance using an actuation voltage of 15 Vpp in air The MOEMS modulator was adapted as integral part of a solidstate photodetection system to overcome the lowfrequency noise
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