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Title of Journal: Microsyst Technol

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Abbravation: Microsystem Technologies

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Springer-Verlag

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DOI

10.1007/bf01854749

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1432-1858

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Flip chip packaging for MEMS microphones

Authors: Gregor Feiertag Matthias Winter Anton Leidl
Publish Date: 2010/02/06
Volume: 16, Issue: 5, Pages: 817-823
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Abstract

We have developed a microphone package using flip chip technology instead of chip and wire bonding to create smaller MEMS microphones With this new packaging technology the transducer chip and an ASIC chip are flip chip bonded on a ceramic substrate The package is sealed by a polymer foil laminated over the chips and by a metal layer The sound port is on the bottom side in the ceramic substrate In this paper the packaging technology is explained in detail and results of electroacoustic characterization and reliability testing are presented We will also explain the way which has led us from the packaging of Surface Acoustic Wave SAW components to the packaging of MEMS microphones

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  16. In-situ fabrication of an out-of-plane microlens with pre-definable focal length
  17. Dynamic calibration method of inertial measurement units
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  19. Design of compact and wide bandwidth SPDT with anti-stiction torsional RF MEMS series capacitive switch
  20. Vibrational energy scavenging with Si technology electromagnetic inertial microgenerators
  21. Elastic coefficient analysis on planar S-shaped micro spring under high impact load
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