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Title of Journal: Microsyst Technol

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Abbravation: Microsystem Technologies

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Springer-Verlag

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DOI

10.1007/978-3-540-74063-6

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1432-1858

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Ultra fine pitch flat panel display packaging usin

Authors: G J Wang Y C Lin G S Lin
Publish Date: 2007/01/26
Volume: 13, Issue: 11-12, Pages: 1471-1475
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Abstract

In this research dependency of the contact resistance on the hardness of the gold bump and process parameters such as the contact area and the load pressure of the extra fine pitch chiponglass COG flat panel display FPD packaging is investigated The FJ2530 anisotropic conductive film ACF by Sony Inc containing the currently smallest 3 μm conductive particles is implemented to conduct the experiments Feasibility of the 3 μm ACF in ultrafine pitch COG applications is further examined From the experimental results we found that no special process is required to obtain a satisfied contact resistance for the ultra fine pitch packaging based on the 3 μm conductive particles It can be concluded that the combination of the 3 μm conductive particles and the IC gold bumps with hardness 70 Hv can lead to a miniaturized device with less cost For mass production test sample with pitch space being larger than 10 μm is suggested to retain a better reliability

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  2. Micro liquid rotor operated by surface-acoustic-wave
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  6. Novel heat dissipation design for light emitting diode applications
  7. Hot embossing of thermoplastic multilayered stacks
  8. Piezoelectric in-plane microplate resonators based on contour and flexure-actuated modes
  9. A review of fabrication processes for vertical comb drives
  10. Reliability of Pt ohmic contact on an undoped 3C-SiC micro-electrothermal device
  11. Design and fabrication of a square shape bulk mode MEMS resonators
  12. Computational fluid dynamics for effects of coolants on on-chip cooling capability with carbon nanotube micro-fin architectures
  13. Cells adhered and cultured on microcantilevers
  14. Elicitation of a reference process model for tool-based micro technologies for planning and controlling purposes and user support
  15. LTO cartridge reel deflection under tape packing stresses
  16. In-situ fabrication of an out-of-plane microlens with pre-definable focal length
  17. Dynamic calibration method of inertial measurement units
  18. Two temperature theory of initially stressed electro-microstretch medium without energy dissipation
  19. Design of compact and wide bandwidth SPDT with anti-stiction torsional RF MEMS series capacitive switch
  20. Vibrational energy scavenging with Si technology electromagnetic inertial microgenerators
  21. Elastic coefficient analysis on planar S-shaped micro spring under high impact load
  22. Mechanical vibration and critical speeds of rotating composite laminate disks
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  24. Precise measurement of angular position and speed of spindle motor during spin-up by computing differences in winding current rise time
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  28. Fabrication of polystyrene microfluidic devices using a pulsed CO 2 laser system
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