Authors: ChaoChi Chang DeShau Huang MingTzer Lin RayHua Horng ChiMing Lai
Publish Date: 2010/01/20
Volume: 16, Issue: 4, Pages: 519-526
Abstract
The authors offer a new design in support of efficient heat dissipation for light emitting diodes LEDs In the first part of this paper we discuss improvements in LED packaging materials and layer assembly and then describe the addition of a thin layer of electroplated copper to the LED base assembly to reduce thermal resistance and increase thermal diffusion efficiency Also described is a threedimensional finite element simulation that we performed to verify the proposed design 075 1 and 3 W LED chip temperatures and a LED heat transfer behavior analysis The results indicate that the addition of a 9 mm2 electroplated copper layer to the LED base assembly improved LED thermal dissipation by reducing chip temperature by 5°C compared to LEDs without the copper layer packaging In the second part of this paper we describe a our heat pipe system/heat sink design for LED illumination and b experiments in which we changed both working fluid mass and rotation angle to determine their effects on heat pipe cooling Our results indicate that the most efficient heat dissipation occurred when an added heat pipe was arranged horizontally Good heat dissipation was observed for heat pipes containing 252 g of water temperature reduced by 50°C Larger water volumes failed to dissipate additional heat due to the presence of steam inside the pipe
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