Authors: Yi Fan Xiaolong Zhong Johan Liu Teng Wang Yan Zhang Zhaonian Cheng
Publish Date: 2008/12/02
Volume: 15, Issue: 3, Pages: 375-381
Abstract
Carbon nanotubes CNTs have shown a broad promising application in high mechanical strength and electronic structure In this work the effects of coolants on heat transfer capability of onchip cooling with CNTs Microfin Architectures was studied and the twodimensional computational fluid dynamics CFD simulations have been done for a series of material parameters of coolants in this paper The influences of thermal conductivity density specific heat and viscosity on cooling have been obtained in the case studies The results demonstrate that pressure drop between the inlet and outlet of the cooling device is dependent on coolant’s density and viscosity Consequently it will be necessary to find out a good balance between heat transfer capability and pressure drop The simulation results also indicate that the heat sink capability will be better if there are more fin rows in the microchannelThis work is supported by Shanghai Pu Jiang Program Support by NSFC Grant No 10702037 and the international cooperation project of Shanghai STC program No 75007004 are greatly appreciated The work at Chalmers University of Technology is supported by the Seventh Framework Program of the European Union Project name Nano Packaging Technology for Interconnection and Heat Dissipation No 216 176
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