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Title of Journal: J Mater Sci Mater Electron

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Abbravation: Journal of Materials Science: Materials in Electronics

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Springer US

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DOI

10.1007/978-1-4757-4988-5

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1573-482X

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Adhesion characteristics of Cu/Ni–Cr/polyimide fle

Authors: BoIn Noh JeongWon Yoon BoYoung Lee SeungBoo Jung
Publish Date: 2008/10/28
Volume: 20, Issue: 9, Pages: 885-890
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Abstract

The adhesion strength of Cu/Ni–Cr/polyimide flexible copper clad laminate FCCL was evaluated according to the composition ratio of the Ni–Cr layer and the thickness of the Cu electroplating layer by using a 90° peel test The changes in the morphology chemical bond and adhesion property were characterized by scanning electron microscopy SEM atomic force microscopy AFM and Xray photoelectron spectroscopy XPS The peel strength of the FCCL increased with increasing Cr content and increasing Cu electroplating layer thickness This increasing FCCL peel strength was attributed to a lower C–N bond and higher C–O and carbonyl C=O bonds in the polyimide surface compared to the FCCL with a lower adhesion strength The adhesion property of the FCCLs was significantly affected by the NiCr ratio

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