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Title of Journal: J Mater Sci Mater Electron

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Abbravation: Journal of Materials Science: Materials in Electronics

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Springer US

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DOI

10.1002/ajmg.a.37111

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ISSN

1573-482X

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Development of a Sn–Ag–Cu solder reinforced with N

Authors: Y D Han S M L Nai H Y Jing L Y Xu C M Tan J Wei
Publish Date: 2010/05/21
Volume: 22, Issue: 3, Pages: 315-322
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Abstract

In this study Nicoated carbon nanotubes NiCNTs were incorporated into the 958Sn35Ag07Cu solder alloy using the powder metallurgy route Up to 03 wt of NiCNTs were successfully incorporated The effects of NiCNTs on the physical thermal and mechanical properties of Sn–Ag–Cu solder alloy were investigated With the addition of increasing weight percentages of NiCNTs the composite solders showed a corresponding decrease in density values and improved wetting properties The thermomechanical property results showed an improvement in thermal stability for the composite solders Mechanical characterization revealed an improvement in ultimate tensile strength up to 12 and 02 yield strength up to 8 with the addition of 005 wt NiCNTs in the solder

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Other Papers In This Journal:
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  12. (111)-Oriented Pb(Zr 0.52 Ti 0.48 )O 3 thin film on Pt(111)/Si substrate using CoFe 2 O 4 nano-seed layer by pulsed laser deposition
  13. Catalyst Ni-assisted synthesis of interweaved SiO/G/CNTs&CNFs composite as anode material for lithium-ion batteries
  14. Synthesis and systematic investigations of Al and Cu-doped ZnO nanoparticles and its structural, optical and photo-catalytic properties
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