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Title of Journal: J Mater Sci Mater Electron

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Abbravation: Journal of Materials Science: Materials in Electronics

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Springer US

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DOI

10.1002/app.12034

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1573-482X

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Microstructures and properties of Sn58Bi Sn35Bi0

Authors: Liang Zhang Lei Sun Yonghuan Guo
Publish Date: 2015/07/01
Volume: 26, Issue: 10, Pages: 7629-7634
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Abstract

Microstructures interface reaction melting characteristics tensile property thermal fatigue behavior and wettability of Sn58Bi Sn35Bi03Ag and Sn35Bi10Ag solders were investigated Only Sn phase and Bi phase like nettype distribute uniformly in the Sn58Bi matrix Sn35Bi03Ag and Sn35Bi10Ag solder show the Ag3Sn particles in the Sn matrix around netlike Bi phase at the solder/Cu solder joints only Cu6Sn5 intermetallic compound was observed The liquid phase line temperature of Sn35Bi03Ag and Sn35Bi10Ag is higher than that of SnBi solder Sn35Bi10Ag solder joints show superiority in mechanical property and fatigue life which can attribute to the strengthening effect of Ag3Sn particles Moreover the wettability of Sn35Bi10Ag solder was best of all and the N2 atmosphere and RMA flux can enhance the wettability obviously which can provide the reference support of the research of SnBi base solders

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