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Title of Journal: J Mater Sci Mater Electron

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Abbravation: Journal of Materials Science: Materials in Electronics

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Springer US

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DOI

10.1007/s004400100175

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1573-482X

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Preparation and conductive mechanism of copper nan

Authors: Wendong Yang Chunyan Liu Zhiying Zhang Yun Liu Shidong Nie
Publish Date: 2013/10/18
Volume: 24, Issue: 12, Pages: 5175-5182
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Abstract

One step and largescale synthetic method of copper nanoparticles NPs with a yield of 9136  has been first developed The asprepared oblateshape copper NPs with a size 80 nm showed good antioxidation The ink of the copper nanoparticles 20 wt onto glass slides easy formed a favorable conductive film at 300 °C Interestingly the coffee ring like structure which often goes with the films by organic conductive inks has been effectively suppressed The experiments revealed that the size and connection of interparticles as well as the elimination degree of organic molecules are three key factors for the conductivity of the copper films

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