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Title of Journal: Journal of Elec Materi

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Abbravation: Journal of Electronic Materials

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Springer US

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DOI

10.1016/0002-9416(61)90206-8

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1543-186X

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Effect of SiC Nanoparticle Additions on Microstruc

Authors: Ping Liu Pei Yao Jim Liu
Publish Date: 2008/02/23
Volume: 37, Issue: 6, Pages: 874-879
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Abstract

In this work leadfree composite solders were produced by mechanically mixing nominal 20 nm moissanite SiC particles with Sn38Ag07Cu solder paste The effects of the amount of SiC addition on the melting behavior microstructure and microhardness of assolidified composite solders were systematically investigated In comparison with solder without the addition of SiC nanoparticles the subgrain of βSn the intermetallic compounds IMCs average grain size and distance decreased significantly in the composite solder matrix This was possibly ascribed to the strong adsorption effect and high surface free energy of the SiC nanoparticles Our results showed that 005 wt addition of SiC nanoparticles could improve the microhardness by 44 compared with the noncomposite and that the average grain size and distance changed from 05 μm to 02 μm and from 06 μm to 032 μm respectively The refined IMCs acting as a strengthening phase in the solder matrix enhanced the microhardness of the composite solders in good agreement with the prediction of the classic theory of dispersion strengthening

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