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Title of Journal: Journal of Elec Materi

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Abbravation: Journal of Electronic Materials

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Springer US

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DOI

10.1007/bf02021500

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1543-186X

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Effects of Minor Ni Doping on Microstructural Vari

Authors: ChiYang Yu TaeKyu Lee Michael Tsai KuoChuan Liu JenqGong Duh
Publish Date: 2010/09/14
Volume: 39, Issue: 12, Pages: 2544-2552
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Abstract

The effects of Ni doping on microstructural variations and interfacial reactions in Cu/Sn30Ag05CuxNi/Au/Ni sandwich structures were investigated The sandwich structures ie Cu/Sn30Ag05Cu/Au/Ni and Cu/Sn30Ag05Cu01Ni/Au/Ni wt were reflowed and isothermally aged at 150°C for 500 h The behavior of Ni and Cu migration in the solders before and after aging was investigated using fieldemission electron probe microanalysis FEEPMA and the microstructure evolution of the solders with Ni doping was investigated It was observed that Ni migrated to the board Cuside while Cu tended to migrate toward the Ni/Au package side and two different types of CuNi6Sn5 intermetallic compounds IMCs one with 198 at to 234 at Ni and the other with 13 at to 64 at Ni content were found Regarding interfacial reactions it was identified that the local Ni and Cu concentrations affected the formation of CuNi6Sn5 Redistribution of Ni and Cu was correlated with the formation mechanism of interfacial CuNi6Sn5

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