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Title of Journal: Journal of Elec Materi

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Abbravation: Journal of Electronic Materials

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Springer US

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DOI

10.1002/9783527687541.ch6

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1543-186X

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Characterization of Generation Lifetime and Surfac

Authors: Haruhiko Yoshida Shingo Kuge
Publish Date: 2010/03/04
Volume: 39, Issue: 6, Pages: 773-776
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Abstract

A contactless Zerbst method has been developed to characterize the generation lifetime and the surface generation velocity of a semiconductor wafer This characterization is unaffected by the gate leakage current or the device fabrication process In this study this contactless Zerbst method was used to characterize the generation lifetime and the surface generation velocity of a partially Audoped Si wafer The results demonstrate that the contactless Zerbst method is a powerful technique for characterizing the generation lifetimes and the surface recombination velocities of semiconductor wafers

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  3. Electromigration in Sintered Nanoscale Silver Films at Elevated Temperature
  4. Levers for Thermoelectric Properties in Titania-Based Ceramics
  5. Using Ge Secondary Phases to Enhance the Power Factor and Figure of Merit of Ge 17 Sb 2 Te 20
  6. Solid–Solid Reaction Between Sn-3Ag-0.5Cu Alloy and Au/Pd(P)/Ni(P) Metallization Pad with Various Pd(P) Thicknesses
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  8. Thermoelectric Properties of Microstructurally Modified CoSb 3 Skutterudite by Hf-Addition
  9. Optical Study of Cuprous Oxide and Ferric Oxide Based Materials for Applications in Low Cost Solar Cells
  10. Mechanical Alloying and Spark Plasma Sintering of Higher Manganese Silicides for Thermoelectric Applications
  11. Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects
  12. Device Characteristics of GaInSb/AlGaSb Quantum Well Lasers Monolithically Grown on GaAs Substrates by Using an Interfacial Misfit Array
  13. Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects
  14. Investigation of Structural and Electrical Properties of B-Site Complex Ion (Mg 1/3 Nb 2/3 ) 4+ -Modified High-Curie-Temperature BiFeO 3 -BaTiO 3 Ceramics
  15. Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu- x Ni/Au/Ni Sandwich Structures
  16. Characterization of Single Barrier Microrefrigerators at Cryogenic Temperatures
  17. Observation of Thermoelectric Voltages from the Two-Dimensional Electron Gas of a HgTe Quantum Well Due to Resonant THz Laser Heating
  18. Thermal Stability and Phase Purity in Polycrystalline Ba 8 Ga x Ge 46− x
  19. Critical Thickness of ZnTe on GaSb(211)B
  20. Transport Properties of Bulk Thermoelectrics: An International Round-Robin Study, Part II: Thermal Diffusivity, Specific Heat, and Thermal Conductivity
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  28. Enhanced Thermoelectric Properties of La-Doped ZrNiSn Half-Heusler Compound
  29. Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys
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