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Title of Journal: Journal of Elec Materi

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Abbravation: Journal of Electronic Materials

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Springer US

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DOI

10.1002/zaac.19764240309

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1543-186X

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Investigation of Gold Nanoparticle Inks for LowTe

Authors: Teymur Bakhishev Vivek Subramanian
Publish Date: 2009/08/18
Volume: 38, Issue: 12, Pages: 2720-
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Abstract

Gold nanoparticle inks were investigated as a potential candidate for leadfree packaging applications Inks consisted of surfactantpassivated nanoparticles dissolved in a solvent Optimized gold inks are able to sinter at temperatures as low as 120°C and achieve conductivities of up to 70 of bulk Once sintered the metallic structure reverts to bulklike properties and approaches bulk reliability and performance Thus nanoparticlebased solders would operate at much lower homologous temperatures as compared with alloybased solders Nanoparticle inks under investigation were sintered at 180°C The resulting material exhibited a resistivity of 5 μΩ cm which is significantly lower than those of PbSn and SnAgCu Electromigration studies were carried out and time to failure was investigated as a function of temperature Electromigration activation energy was calculated through Black’s equation to be 052 eV which is consistent with surface/grain boundary diffusion These studies suggest that nanoparticleinkbased films show excellent robustness due to their irreversible conversion to bulklike materials Nanoparticle inks are thus promising candidates for nextgeneration leadfree soldersThis article is published under an open access license Please check the Copyright Information section for details of this license and what reuse is permitted If your intended use exceeds what is permitted by the license or if you are unable to locate the licence and reuse information please contact the Rights and Permissions team

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  12. Device Characteristics of GaInSb/AlGaSb Quantum Well Lasers Monolithically Grown on GaAs Substrates by Using an Interfacial Misfit Array
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