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Title of Journal: Journal of Elec Materi

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Abbravation: Journal of Electronic Materials

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Springer US

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DOI

10.1002/chin.199011294

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1543-186X

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Microstructure Thermal and Wetting Properties o

Authors: Xu Chen Feng Xue Jian Zhou Sidong Liu Guotong Qian
Publish Date: 2013/05/25
Volume: 42, Issue: 8, Pages: 2708-2715
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Abstract

The microstructures phase transformations and wettability of SnBiZn solder alloys were investigated by scanning electron microscopy xray diffraction and differential scanning calorimetry DSC The results show that the alloys are composed of primary Snrich phase or Znrich phase Sn + Zn eutectic structure and Sn + Bi + Zn ternary eutectic structure The microstructural characterization of SnxBiZn alloys indicates that with increasing Bi content more of the eutectic SnBiZn structures is formed DSC profiles reveal that the eutectic peak of the samples did not differ very much but the reaction temperature of the alloys decreases with increased Bi content The spreading rates of solders increased with the addition of Zn which affects the interfacial reactions between the solders and copper

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  13. Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects
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