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Title of Journal: Journal of Elec Materi

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Abbravation: Journal of Electronic Materials

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Springer US

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DOI

10.1002/qua.10846

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1543-186X

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IMC Growth at the Interface of Sn–20Ag–25Zn Sold

Authors: Jiaxing Liang Haozhe Wang Anmin Hu Ming Li
Publish Date: 2014/07/25
Volume: 43, Issue: 11, Pages: 4119-4125
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Abstract

Growth of intermetallic compounds IMC at the interface of Sn–20Ag–25Zn solder joints with Cu Ni and Ni–W substrates have been investigated For the Cu substrate a Cu5Zn8 IMC layer with Ag3Sn particles on top was observed at the interface this acted as a barrier layer preventing further growth of Cu–Sn IMC For the Ni substrate a thin Ni3Sn4 film was observed between the solder and the Ni layer the thickness of the film increased slowly and steadily with aging For the Ni–W substrate a thin Ni3Sn4 film was observed between the solder and Ni–W layer During the aging process a thin layer of the Ni–W substrate was transformed into a bright layer and the thickness of bright layer increased with aging

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