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Title of Journal: Journal of Elec Materi

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Abbravation: Journal of Electronic Materials

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Springer US

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10.1002/jnr.490060608

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1543-186X

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Initial Corrosion Behavior and Mechanism of PCB–HA

Authors: Kangkang Ding Kui Xiao Chaofang Dong Shiwen Zou Pan Yi Xiaogang Li
Publish Date: 2015/08/13
Volume: 44, Issue: 11, Pages: 4405-4417
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Abstract

A longterm 1 3 and 6 months outdoor exposure test was performed for leadfree hot air solder leveling printed circuit boards PCB–HASL in typical environments in China and the corrosion behavior and mechanism of outdoor PCB–HASL were investigated In a dry environment PCB–HASL corroded slightly because of the protective effect of surface oxide films Corrosion spread from places where dust particles were deposited or mold spores were adsorbed Under the combined effects of humidity and contamination large amounts of granular corrosion products with a loose structure were generated greatly reducing the protective effect of the Sn layer Furthermore protection of the edges of the plates was poor and corrosion products from these regions migrated rapidly on the FR4 board When a 12 V electrical bias was applied Sn and Cu migrated simultaneously In the electrochemical migration process the effect of humidity was much more critical than that of contamination

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