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Title of Journal: Journal of Elec Materi

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Abbravation: Journal of Electronic Materials

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Springer US

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DOI

10.1007/s10994-010-5223-6

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1543-186X

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Effects of Electric Discharge Plasma Treatment on

Authors: Levent Parali Mirza A Kurbanov Azad A Bayramov Farida N Tatardar Ramazanova I Sultanakhmedova Huseynova Gulnara Xanlar
Publish Date: 2015/09/04
Volume: 44, Issue: 11, Pages: 4322-4333
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Abstract

Highdensity polymer composites with semiconductor or dielectric fillers such as aluminum nitride AIN aluminum oxide Al2O3 titanium carbide TiC titanium nitride TiN boron nitride BN silicon nitride Si3N4 and titanium carbonitride TiCN were prepared by the hot pressing method Each powder phase of the composites was exposed to an electric discharge plasma process before composite formation The effects of the electric discharge plasma process and the filler content volume fraction on the thermal conductivity volt–ampere characteristics thermally stimulated depolarization current as well as electrical and mechanical strength were investigated The results of the study indicate that with increasing filler volume fraction the thermal conductivity of the samples also increased Furthermore the thermal conductivity and electrophysical and mechanical properties of the highdensity polyethylene + 70 BN composite modified using the electric discharge plasma showed improvement when compared with that without electric discharge plasma treatment

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Other Papers In This Journal:
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  3. Electromigration in Sintered Nanoscale Silver Films at Elevated Temperature
  4. Levers for Thermoelectric Properties in Titania-Based Ceramics
  5. Using Ge Secondary Phases to Enhance the Power Factor and Figure of Merit of Ge 17 Sb 2 Te 20
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  7. Growth Parameters for Thin Film InBi Grown by Molecular Beam Epitaxy
  8. Thermoelectric Properties of Microstructurally Modified CoSb 3 Skutterudite by Hf-Addition
  9. Optical Study of Cuprous Oxide and Ferric Oxide Based Materials for Applications in Low Cost Solar Cells
  10. Mechanical Alloying and Spark Plasma Sintering of Higher Manganese Silicides for Thermoelectric Applications
  11. Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects
  12. Device Characteristics of GaInSb/AlGaSb Quantum Well Lasers Monolithically Grown on GaAs Substrates by Using an Interfacial Misfit Array
  13. Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects
  14. Investigation of Structural and Electrical Properties of B-Site Complex Ion (Mg 1/3 Nb 2/3 ) 4+ -Modified High-Curie-Temperature BiFeO 3 -BaTiO 3 Ceramics
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  17. Observation of Thermoelectric Voltages from the Two-Dimensional Electron Gas of a HgTe Quantum Well Due to Resonant THz Laser Heating
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  29. Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys
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