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Title of Journal: Journal of Elec Materi

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Abbravation: Journal of Electronic Materials

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Springer US

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DOI

10.1007/s001080050217

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1543-186X

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Highly Conductive and Reliable CopperFilled Isotr

Authors: Wenjun Chen Dunying Deng Yuanrong Cheng Fei Xiao
Publish Date: 2015/05/05
Volume: 44, Issue: 7, Pages: 2479-2487
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Abstract

The easy oxidation of copper is one critical obstacle to highperformance copperfilled isotropically conductive adhesives ICAs In this paper a facile method to prepare highly reliable highly conductive and lowcost ICAs is reported The copper fillers were treated by organic acids for oxidation prevention Compared with ICA filled with untreated copper flakes the ICA filled with copper flakes treated by different organic acids exhibited much lower bulk resistivity The lowest bulk resistivity achieved was 45 × 10−5 Ω cm which is comparable to that of commercially available Agfilled ICA After 500 h of 85°C/85 relative humidity RH aging the treated ICAs showed quite stable bulk resistivity and relatively stable contact resistance Through analyzing the results of xray diffraction xray photoelectron spectroscopy and thermogravimetric analysis we found that with the assistance of organic acids the treated copper flakes exhibited resistance to oxidation thus guaranteeing good performance

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