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Title of Journal: Journal of Elec Materi

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Abbravation: Journal of Electronic Materials

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Springer US

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DOI

10.1007/s10086-011-1189-7

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1543-186X

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Electronic Structure and Thermoelectric Properties

Authors: T Takeuchi Y Toyama H Hazama R Asahi
Publish Date: 2010/07/14
Volume: 39, Issue: 9, Pages: 1433-1438
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Abstract

In order to develop practical thermoelectric materials consisting solely of environmentally friendly elements we investigated the thermoelectric properties of the Al10Mn3type P63/mmc hp26 Al77−x Mn23Si x alloys and the Al102Mn24Si12type Pm3 cP138 Al82−x Mn55Fe125Si x alloys both of which possess a pseudogap at the Fermi level The formation range in which the single phase is obtained was determined for these two phases The electrical resistivity Seebeck coefficient and thermal conductivity of the samples involving no secondary phase were measured over the temperature range of 2 K to 300 K It is found that the thermoelectric properties of these phases are qualitatively accounted for in terms of the pseudogap at the Fermi level in the electronic density of states and the disordering in local atomic arrangements

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  4. Levers for Thermoelectric Properties in Titania-Based Ceramics
  5. Using Ge Secondary Phases to Enhance the Power Factor and Figure of Merit of Ge 17 Sb 2 Te 20
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  8. Thermoelectric Properties of Microstructurally Modified CoSb 3 Skutterudite by Hf-Addition
  9. Optical Study of Cuprous Oxide and Ferric Oxide Based Materials for Applications in Low Cost Solar Cells
  10. Mechanical Alloying and Spark Plasma Sintering of Higher Manganese Silicides for Thermoelectric Applications
  11. Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects
  12. Device Characteristics of GaInSb/AlGaSb Quantum Well Lasers Monolithically Grown on GaAs Substrates by Using an Interfacial Misfit Array
  13. Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects
  14. Investigation of Structural and Electrical Properties of B-Site Complex Ion (Mg 1/3 Nb 2/3 ) 4+ -Modified High-Curie-Temperature BiFeO 3 -BaTiO 3 Ceramics
  15. Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu- x Ni/Au/Ni Sandwich Structures
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