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Title of Journal: Journal of Elec Materi

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Abbravation: Journal of Electronic Materials

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Springer US

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DOI

10.1002/zoo.21185

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1543-186X

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Microstructures and Mechanical Properties of Sn0

Authors: Xu Chen Jian Zhou Feng Xue Jing Bai Yao Yao
Publish Date: 2014/12/04
Volume: 44, Issue: 2, Pages: 725-732
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Abstract

The influences of minor alloying elements Co Ni and Nd on the microstructures and mechanical properties of Sn01Ag07Cu SAC0107 solder were investigated The results show that the microstructures of SAC0107 alloy mainly consisted of primary Snrich phases and eutectic phases composed of Ag3Sn and Cu6Sn5 phases dispersed in a Sn matrix With Co or Ni additions the amount of primary Snrich phase reduced and IMCs dispersed more uniformly in the Sn matrix The elements of Co and Ni were concentrated in Co x Cu1−x 6Sn5 and Ni x Cu1−x 6Sn5 intermetallic compounds IMCs respectively and they also entered the IMC layer between solder alloys and Cu substrate during soldering Shear strength of the joints all increased by adding Co Ni and Nd elements Different from the Co and Nd additions the addition of the Ni element also markedly improved the tensile strength and elongation of SAC0107 alloys

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