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Title of Journal: Journal of Elec Materi

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Abbravation: Journal of Electronic Materials

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Springer US

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DOI

10.1007/s10509-014-1905-z

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1543-186X

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Abnormal Failure Behavior of Sn35Ag Solder Bumps

Authors: JangHee Lee YoungBae Park
Publish Date: 2009/06/18
Volume: 38, Issue: 10, Pages: 2194-2200
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Abstract

Abnormal failure behavior of flip chip Sn35Ag solder bumps with a Cu underbump metallurgy under excessive electric current stressing conditions is investigated with regard to electromigration lifetime characteristics and damage evolution morphologies Abnormal behavior such as abrupt changes in the slope of the resistance versus stressing time curve correlate well with the changes in mean time to failure and the standard deviation with respect to␣the resistance increase ratio which seems to be strongly related to highly␣accelerated electromigration test conditions of 120°C to 160°C and 3 × 104 A/cm2 to 46 × 104 A/cm2 This is closely related to changes in the damage evolution mechanism with time even though the activation energy for electrical failure is primarily controlled by Cu diffusion through CuSn intermetallic compound layersThis work was supported by Hynix Semiconductor Inc and partially by a joint research project of The Korea Research Council for Industrial Science and Technology of the Korea Ministry of Knowledge Economy The authors would like to thank ST Yang MS Suh QH Chung and KY Byun for valuable discussions and sample preparations

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