Authors: P Protsenko O Kozlova R Voytovych N Eustathopoulos
Publish Date: 2008/08/01
Volume: 43, Issue: 16, Pages: 5669-5671
Abstract
Dissolutive wetting occurs when a liquid spreads over a solid surface with simultaneous dissolution of the solid into the liquid This process is of great interest for both fundamental research and several industrial processes an important example being soldering in microelectronics fabrication processes 1 Several studies performed for various liquid metal/solid metal systems have shown that for millimetresized droplets the spreading time in dissolutive wetting ranges from a few to several hundred seconds 2 3 4 5 6 This time is orders of magnitude higher than the spreading time found in liquid metal/solid metal systems with negligible miscibility which is typically around 10 ms 7 8 9 10 11 Despite the progress made over the last 10 years in the understanding of dissolutive wetting several points remain obscure concerning both the driving force and kinetics of this type of wetting The aim of the work reported in this paper is to contribute to this subject by
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