Authors: Xilin Peng Allan Matthews Song Xue
Publish Date: 2010/10/29
Volume: 46, Issue: 1, Pages: 1-37
Abstract
Plasmabased thin film equipment and processes have been widely used for microelectronics information storage sensors and energy harvest/storage devices To achieve higher package density large storage capacity and to meet other specific stringent design criteria the film layer thickness is often reduced to a few nanometers or even to a few angstroms while the device dimension has been shrinking to submicrometer scales As the material thickness h approaches atomic dimension and the device dimension w × d approaches a few tens of nanometers thin film layer uniformity and interlayer mixing as well as device edge damage control are crucial for its performance and reliability In this review paper we will discuss briefly vacuum and plasma aspects followed by a detailed review on various plasmabased thin film deposition and removal techniques The deposition methods discussed here include magnetron sputtering ion beam deposition IBD and plasma enhanced chemical vapor deposition PECVD We focus on the advantages and disadvantages of various hardware configurations and how to achieve uniform film growth over large area with minimized interlayer mixing for any specific process The device patterning aspects cover ion beam etching IBE reactive ion etching RIE and various techniques for endpoint detection of etching processes We discuss how the definition technique affects edge damage profile and dimension w × d control as well as postdefinition corrosion behavior Some specific examples will be presented to highlight how the physical principles can be used in practice for film/device property controlXP is grateful for stimulating discussion in the past years with the following professionals at various organizations Dr Y Kusano Riso national Lab Denmark Prof J Lawler University of WisconsinMadison Mr J Scott Novellus Corp Dr W Chen Ulvac Inc Mr P Welsh Mr K Toru Mr Kodaira Ms Matsui Mr S Furakawa CanonAnelva Dr B Oliver and A Morrone Seagate Technology
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