Authors: Anas M Atieh Tahir I Khan
Publish Date: 2014/07/30
Volume: 49, Issue: 22, Pages: 7648-7658
Abstract
The transient liquid phase TLP bonding of Ti6Al4V alloy to a MgAZ31 alloy was performed using an electrodeposited Ni coating containing a dispersion of Ni and Cu nanoparticles Bond formation was attributed to two mechanisms first solidstate diffusion of Ni and Mg followed by liquid eutectic formation at the MgAZ31 interface Second the solidstate diffusion of Ni and Ti at the Ti6Al4V interface resulted in a metallurgical joint The joint interface was characterized by scanning electron microscopy energy dispersive Xray spectroscopy and Xray diffraction analysis Microhardness and shear strength tests were used to investigate the mechanical properties of the bonds The use of Cu nanoparticles as a dispersion produced the maximum joint shear strength of 69 MPa This shear strength value corresponded to a 15 enhancement in joint strength compared to TLP bonds made without the use of nanoparticles dispersion
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