Authors: Jia Sun Guangchen Xu Fu Guo Zhidong Xia Yongping Lei Yaowu Shi Xiaoyan Li Xitao Wang
Publish Date: 2011/01/19
Volume: 46, Issue: 10, Pages: 3544-3549
Abstract
The motivation of this study is tried to explore the relationship between resistance changes and microstructure evolution of eutectic SnBi solder joints under 104 A/cm2 of current density and 50 °C of ambient temperature A novel type of onedimensional solder joints was employed to achieve a true uniform distribution of current density and a realtime data acquisition system was employed to investigate the voltage changes of the eutectic SnBi solder joints during electromigration process This study suggested that the resistance remained initially due to the interaction between coarsened phase and Joule heating effect and then increased due to the formation of continuous Birich phase at anode interface finally remained again due to the phase segregation of Bi and Snrich phasesThe authors acknowledge the financial support of this study from the Beijing Natural Science Foundation Program and Scientific Research Key Program of the Beijing Municipal Commission of Education KZ200910005004 the Academic Innovation Group Supporting Program of Beijing Municipality and the China Scholarship Council 2008654006 The authors also thank C Henry Wang of Henkel Corp for providing the eutectic Sn–Bi solder balls
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